Module and method for constructing modular building

ABSTRACT

A modular structure is disclosed for creating a substantially airtight, well insulated building envelope in a multilevel building that reduces air or moisture infiltration. The modular structure comprises a plurality of joists separated by a predetermined distance and aligned along a first direction; a plurality of nailing strips located proximate each of the plurality of joists and aligned along a second direction, which is substantially perpendicular to the first direction; a band joist aligned along a third direction, which is substantially perpendicular to the first direction or the second direction; an exterior sheathing; and a block, wherein at least two of the band joist, the exterior sheathing and the block are configured to form a cavity for receiving an insulating material.

CROSS REFERENCE TO PRIOR APPLICATIONS

This application claims priority and the benefit thereof from U.S. Provisional Application No. 61/220,445, filed Jun. 25, 2009, titled “Framing Design Providing Open Space for Factory Installed Ductwork in Multilevel Buildings,” the entirety of which is hereby incorporated herein by reference. This application also claims priority and the benefit thereof from U.S. Provisional Application No. 61/220,440, filed Jun. 25, 2009, titled “Air Infiltration Barrier and Spray Foam Band Joist Blocking Assembly for Modular Buildings,” the entirety of which is hereby incorporated herein by reference. This application further claims priority and the benefit thereof from U.S. Provisional Application No. 61/220,406, filed Jun. 25, 2009, titled “Spray Foam Band Joist Blocking Assembly for Modular Buildings Having Open-Web Floor Truss Assemblies,” the entirety of which is hereby incorporated herein by reference.

FIELD OF THE DISCLOSURE

The present disclosure relates to a method and a system for creating a complete exterior wall insulation assembly or building envelope for a multilevel modular building. The present disclosure also relates to a method and a system for substantially eliminating air, moisture and/or water infiltration into an interior of a modular building. The present disclosure further relates to a method and a system for providing space for installation of, for example, ductwork, or the like, and for minimizing sound travel between levels of a multilevel modular building.

BACKGROUND OF THE DISCLOSURE

Typically, modular building construction starts with construction of the floor joists. Then, exterior wall panels are assembled separately and lowered onto the subfloor and attached as a panel. The inventor has discovered that the area between the exterior wall panels and floor decking frequently allows air and/or moisture to infiltrate into the building interior, thereby reducing the effectiveness of, for example, heating, ventilating, and cooling (HVAC) systems. The inventor has also discovered that the area between levels, in a multilevel modular building, allows for heat transfer between the exterior of the building and interior areas of the building, resulting in poor energy efficiency in heating and/or cooling the interior areas.

In multilevel modular building construction, one of two approaches are commonly implemented in dealing with air infiltration and lack of insulation in band joist assemblies. Standard industry practice includes, for example, not installing any insulation at the band joists, or gluing (or stapling) fiberglass batt insulation to interiors of band joists. However, the fiberglass batt insulation is frequently damaged or removed during shipping or construction of modular buildings. Furthermore, even if the fiberglass survives shipping or construction, the fiberglass is ineffective for sealing out air or moisture at the band joists.

Modular construction of buildings does not generally consider future installation of, for example, heating, ventilating, and air-conditioning (HVAC) ductwork. HVAC work tends to be left for site construction. In this regard, typical HVAC systems in a multilevel modular building include a separate air handler and compressor for each of the levels. This tends to result in the ductwork being left to unconditioned space, thereby greatly adding to the cost of heating and cooling the multilevel modular building.

An unfulfilled need exists for a method and a system for eliminating air infiltration between the floor decking and exterior walls of a modular building, as well as a method and a system for providing enhanced insulation between levels in a multilevel modular building. A further unfulfilled need exists for a method and a system for facilitating easy and relatively low cost ductwork into a multilevel building.

SUMMARY OF THE DISCLOSURE

A method and a system are provided for reducing construction costs, reducing conditioning costs (e.g., cost associated with heating or cooling a space), and increasing conditioning efficiency of a multilevel building. The method and system may provide reduced noise transfer between levels in a multilevel modular building. The method and system may create a space between levels in a multilevel building to allow ductwork, plumbing, wiring, and/or the like, to be installed between levels.

According to an aspect of the disclosure, the method may be implemented to create a space between levels in a multilevel building to allow ductwork, plumbing, wiring, and/or the like, to be installed between levels. The method may comprise constructing a perimeter rim joist of each section of a module of the building with a multi-beam assembly; and, on a lower level module of the building, topping a double-beam assembly with a stud. The method may further comprise, on the upper level module, attaching another stud on the bottom of a double-beam assembly. When the building modules are stacked onsite, a space may be created between the modules to allow ductwork, plumbing, wiring, and/or the like, to be installed in the factory, prior to shipping.

According to a further aspect of the disclosure, a method and a system are provided for creating a substantially airtight, well insulated building envelope that reduces the risk of mold, or the like, e.g., in hot-humid climates. The method comprises: constructing a first level ceiling assembly and a second level floor assembly of manufactured open web floor trusses; and creating a cavity (e.g., approximately 5.5″ in width) in from the exterior of a band joist, around the entire perimeter of the modular building, wherein the cavity extends from a top surface of, for example, a sheetrock of the lower level ceiling assembly to the subfloor of the upper level. The method may further comprise substantially vertically attaching a nailing strip to either side of each truss, wherein the side of the nailing strip facing the building's interior may be a predetermined distance from an interior side of the band joist material. The method may further comprise attaching a board to the interior sides of the nailing strips, using mechanical fasteners, such as, e.g., nails, screws, or the like, and providing a hole through the band joists near the center of each space between the trusses. This method may be carried out for both the upper and lower level modules on the sides that are to be exterior walls. All construction of the blocking assembly may be done on an assembly line in a plant. Once the modular building is set onsite, the method may comprise injecting an insulation material (such as, e.g., a spray foam insulation, a “pour-fill” open cell spray foam, or the like) through each of the holes in the lower level band joists; and then injecting the insulation material through each of the holes in the upper level band joists into the cavities. When the cavities are substantially filled with the insulation, the cavities may create a continuous insulation and air barrier around the entire perimeter of the home from the top of the lower level ceiling, to the bottom of the upper level subfloor. The method and system may reduce, inter alia, the risk of indoor mold growth and exterior water penetration in the interior of the modular building.

According to a still further aspect of the disclosure, a method and a system are provided for eliminating air infiltration between the floor decking and exterior wall bottom plates of modular buildings. The method may comprise: applying multiple (e.g., three) continuous beads of construction adhesive to the perimeter of the subfloor; and attaching the exterior wall panels to the subfloor having the continuous beads of construction adhesive.

According to a still further aspect of the disclosure, a method and system are provided for enabling a complete exterior wall insulation assembly or envelope for a multilevel modular building. The system comprises a first level ceiling assembly and a second level floor assembly, both of which may comprise joists made from, for example, wood. The system comprises a cavity of a predetermined depth that is created in from the exterior of a band joist around the entire perimeter of the building. The cavity may extend from the top of the first level ceiling to the bottom of the second level subfloor assembly. A first nailing strip may be applied vertically to both sides of each band joist. The side of the first nailing strip facing the exterior of the building may be positioned at a distance from the interior side of the band joist material equal to the predetermined depth of the cavity. A panel may be attached to interior side of the first nailing strips. Then, a hole may be drilled through the band joist near the center of each space between the joists.

According to a still further aspect of the disclosure, a method is provided for enabling a complete exterior wall insulation assembly or envelope in a multilevel modular building, comprising: positioning a nailing strip proximate a side of a joist at a predetermined distance from an edge of the joist, wherein the longitudinal axis of the nailing strip may be positioned at substantially ninety-degrees with respect to the longitudinal axis of the joist; attaching the nailing strip to the joist; positioning a panel proximate the nailing strip, wherein the panel may be positioned between a pair of joists, attaching the panel to the nailing strip; drilling a hole through a band joist near the center of a space formed by the pair of joists; and filling the space with an insulating foam.

According to an aspect of the disclosure, a modular structure is disclosed for creating a substantially airtight, well insulated building envelope in a multilevel building that reduces air or moisture infiltration. The modular structure comprises: a plurality of joists separated by a predetermined distance and aligned along a first direction; a plurality of nailing strips located proximate each of the plurality of joists and aligned along a second direction, which is substantially perpendicular to the first direction; a band joist aligned along a third direction, which is substantially perpendicular to the first direction or the second direction; an exterior sheathing; and a block, wherein at least two of the band joist, the exterior sheathing and the block are configured to form a cavity for receiving an insulating material. The band joint may comprise a multi-beam assembly. The plurality of nailing strips may be positioned so that a longitudinal axis of at least one of the nailing strips is substantially perpendicular to a longitudinal axis of at least one of the plurality of joists. A side of at least one of the plurality of nailing strips may be located a predetermined distance away from the exterior sheathing. An opposite side of the at least one of the plurality of nailing strips may be located proximate to the block. The sheathing may comprise an opening to allow access to the cavity, and wherein the insulating material is injected in the cavity through the opening. The band joist may comprise an opening to allow access to the cavity, and wherein the insulating material is injected in the cavity through the opening. The modular section may further comprise: a floor; a sill plate; and a substantially continuous bead between the floor and the sill plate.

According to a further aspect of the disclosure, a method is disclosed for creating a substantially airtight and well insulated building envelope. The method comprises: aligning a plurality of joists along a first direction; aligning a plurality of studs along a second direction, which is substantially perpendicular to the first direction; aligning a band joist along a third direction, which is substantially perpendicular to the first direction or the second direction; aligning an exterior sheathing in a plane that is substantially perpendicular to the first direction; and providing a block between two of the plurality of joists at a predetermined distance from the exterior sheathing, wherein at least two of the band joist, the exterior sheathing and the block are configured to form a cavity for receiving an insulating material.

The method may further comprise: aligning a plurality of nailing strips along the second direction, wherein the nailing strips are configured to support the block; assembling the plurality of joists, the plurality of studs, the band joist, the block and the exterior sheathing; providing an opening in at least one of the band joist and the exterior sheathing; and/or injecting the insulating material into the cavity to substantially fill the cavity. The plurality of nailing strips may be positioned at a predetermined distance from the exterior sheathing. The method may further comprise: providing a floor; providing a sill plate; and applying a substantially continuous bead between the floor and the sill plate.

According to a still further aspect of the disclosure, a method is provided for creating a substantially airtight and well insulated building envelope. The method comprises: aligning a plurality of joists along a first direction; aligning a plurality of studs along a second direction, which is substantially perpendicular to the first direction; aligning a band joist along a third direction, which is substantially perpendicular to the first direction or the second direction; aligning an exterior sheathing in a plane that is substantially perpendicular to the first direction; providing a block between two of the plurality of joists at a predetermined distance from the exterior sheathing; and assembling the plurality of joists, the plurality of studs, the band joist, the block and the exterior sheathing, wherein at least two of the band joist, the exterior sheathing and the block are configured to form a cavity for receiving an insulating material. The method may further comprise: providing a plurality of nailing strips along the second direction, wherein the nailing strips are configured to support the block; providing an opening in at least one of the band joist and the exterior sheathing; and/or injecting the insulating material into the cavity to substantially fill the cavity. The method may further comprise: providing a floor; providing a sill plate; and applying a substantially continuous bead between the floor and the sill plate.

Additional features, advantages, and embodiments of the disclosure may be set forth or apparent from consideration of the following detailed description and drawings. Moreover, it is noted that both the foregoing summary of the disclosure and the following detailed description are exemplary and intended to provide further explanation without limiting the scope of the disclosure as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a further understanding of the disclosure, are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the detailed description serve to explain the principles of the disclosure. No attempt is made to show structural details of the disclosure in more detail than may be necessary for a fundamental understanding of the disclosure and the various ways in which it may be practiced.

FIG. 1 shows an example of a multilevel modular building, according to principles of the disclosure;

FIG. 2 shows a detailed view of an example of a section of the multilevel modular building shown in FIG. 1;

FIG. 3 shows a plan or top view of the insulating assembly of FIG. 2;

FIG. 4 shows a detailed view of the portion of the insulating assembly of FIG. 2;

FIG. 5 shows an example of a process for providing a complete exterior wall insulation assembly or building envelope in a multilevel modular building, according to principles of the disclosure.

FIG. 6 shows a detailed view of another example of a section of the multilevel modular building shown in FIG. 1;

FIG. 7 shows an example of a process for constructing a modular building comprising a space for pre-installed ductwork, plumbing, electricity, and the like, between levels of a multi-level building, according to principles of the disclosure;

FIG. 8 shows a detailed view of another example of a section of the multilevel modular building of FIG. 1;

FIG. 9 shows a zoomed-in view of the section of the multilevel modular building shown in FIG. 8;

FIG. 10 shows a top view of an example of a cross-section of a portion of the multilevel modular building shown in FIG. 1;

FIG. 11 shows an example of a floor portion of, e.g., a lower level of the multilevel modular building shown in FIG. 1;

FIG. 12 shows a zoomed-in view of a connecting portion between a sill plate and a floor panel of the floor portion shown in FIG. 11; and

FIG. 13 shows an example of a process for providing a complete exterior wall insulation assembly or envelope in a multilevel modular building of FIG. 1, according to principles of the disclosure.

The present disclosure is further described in the detailed description that follows.

DETAILED DESCRIPTION OF THE DISCLOSURE

The embodiments of the disclosure and the various features and advantageous details thereof are explained more fully with reference to the non-limiting embodiments and examples that are described and/or illustrated in the accompanying drawings and detailed in the following description. It should be noted that the features illustrated in the drawings are not necessarily drawn to scale, and features of one embodiment may be employed with other embodiments as the skilled artisan would recognize, even if not explicitly stated herein. Descriptions of well-known components and processing techniques may be omitted so as to not unnecessarily obscure the embodiments of the disclosure. The examples used herein are intended merely to facilitate an understanding of ways in which the disclosure may be practiced and to further enable those of skill in the art to practice the embodiments of the disclosure. Accordingly, the examples and embodiments herein should not be construed as limiting the scope of the disclosure, which is defined solely by the appended claims and applicable law. Moreover, it is noted that like reference numerals represent similar parts throughout the several views of the drawings.

The terms “including”, “comprising” and variations thereof, as used in this disclosure, mean “including, but not limited to”, unless expressly specified otherwise.

The terms “a”, “an”, and “the”, as used in this disclosure, means “one or more”, unless expressly specified otherwise.

When a single device or article is described herein, it will be readily apparent that more than one device or article may be used in place of a single device or article. Similarly, where more than one device or article is described herein, it will be readily apparent that a single device or article may be used in place of the more than one device or article. The functionality or the features of a device may be alternatively embodied by one or more other devices which are not explicitly described as having such functionality or features.

Although process steps, method steps, algorithms, or the like, may be described in a sequential order, such processes, methods and algorithms may be configured to work in alternate orders. In other words, any sequence or order of steps that may be described does not necessarily indicate a requirement that the steps be performed in that order. The steps of the processes, methods or algorithms described herein may be performed in any order practical. Further, some steps may be performed simultaneously.

FIG. 1 shows an example of a multilevel modular building 100, according to principles of the disclosure. As seen in FIG. 1, the building 100 comprises a first level 101 and a second level 201. The first level 101 may have a first floor wall height of, for e.g., about nine feet (9′ 0″) and the second level 201 may have a second floor wall height of, e.g., about eight feet (8′ 0″). Of course, the first level 101 and second level 201 may have other wall heights, such as, for example, seven feet, eight feet, nine feet, ten feet, or the like, depending on such factors as, for example, aesthetic preference, local codes, overall building design, or the like.

The first level 101 may be assembled as shown in FIG. 1 and it may comprise a bottom board 105 (e.g., a 0.40″ PolyMax board, which may be installed on site), insulation 110 (e.g., R-19 floor insulation, which may be installed on site), a plurality of floor joists 115 (e.g., 2″×10″ SPF #2 floor joists installed, e.g., every 16″, or floor trusses), a floor 120 (e.g., ⅝″ plywood, or OSB Sturdi floor 20″ O.C.), a perimeter board 125 (e.g., a 2″×10″ perimeter no. 2 SPF min.), and walls 130 (e.g., including 7/16″OSB sheathing, R-13 wall insulation, 2″×6″ studs, and the like). The first level 101 may be affixed to a foundation 135. The first level 101 may further comprise fasteners 140 (e.g., 22 GA.×1.5″ steel straps from wall studs to floor joist with, e.g., 0.148″×3″ nails per strap end) that fasten the walls 130 to the floor joists 115, and a bottom plate 145 (e.g., a single 2″×6″ SPF #2).

On its upper end, the first level 101 may comprise a plurality of joists 150 (e.g., 2″×6″ SPF #2 O.C., or ceiling trusses), insulation and perimeter 155 (e.g., R-19 insulation and perimeter), a ceiling 160 (e.g., ½′ gypsum board), a double top plate 165 (e.g., including double 2″×6″ top plate offset butt joints 48″ min.) and a band joist 170, such as, for example, a multi-beam assembly (e.g., double 2″×12″ perimeter no. 2 SPF min.).

The second level 201 may be assembled as shown in FIG. 1 and it may comprise a band joist 205, such as, for example, a multi-beam (or single beam) assembly (e.g., double 2″×10″ perimeter no. 2 SPF min.), a sill plate 210 (e.g., a 2″×6″ sill plate SPF #2), floor joists 212 (e.g., floor trusses), a floor 215 (e.g., ⅝″ plywood or OSB Sturdi floor 20″ O.C.), walls 220 (including, e.g., R-13 wall insulation, 2″×6″ studs, 7/16″ OSB Sheathing min., and the like), and a bottom plate 222 (e.g., a single 2″×6″ SPF #2 bottom plate). At the lower end of the second level 201, the walls 220 may be attached to the floor by means of fasteners 275 (e.g., RS250 USP straps from wall to floor, e.g., every 16″ O.C.).

The upper end of the second level 201 may comprise a double top plate 225 (e.g., double 2″×6″ top plate offset butt joints 48″ min.), a rim rail 235 (e.g., a 2″×6″ rim rail), insulation 240 (e.g., R-30 insulation, which may installed on site), a roof 245 (e.g., 235# shingles, 7/16″ 24/16 index structural 1 roof sheathing, felt roof underlayment or other approved material, and the like), a vent 250 (e.g., DWV vent pipes to extend 10″ past roof), a roof vent 255, and trusses 280 (e.g., spaced about 24″ O.C.).

FIG. 2 shows a horizontal section view of an insulating assembly portion of the multilevel modular building 100 shown in FIG. 1. Referring to FIGS. 1 and 2, any one or more of the joists 115, 150, 212, may include trusses. As seen in FIG. 2, the insulating assembly may include a nailing strip 305 (e.g., a 2″×4″ stud) attached to each side of a truss (115, 150, and/or 212), a block 310 (e.g., 7/16″ OSB, or the like), and a stud 315 (e.g., a 2″×4″ stud). A hole 335 (e.g., a 1½″ round hole) may be cut (or drilled) out of an exterior sheathing 320, for filling a cavity 325 with, e.g., a foam insulation.

FIG. 3 shows a plan or top view of the insulating assembly of FIG. 2, according to principles of the disclosure.

FIG. 4 shows a detailed view of the portion of the insulating assembly where the nailing strips 305 attach to an end of the truss (115, 150, and/or 212) to form the cavity 325 with the blocks 310, wherein the cavity 325 has a depth d (e.g., about 5½″).

Although the nailing strips 305 are shown in FIG. 4 as being located in the cavity 325, proximate a side of each block 310 facing a respective cavity 325, the nailing strips 305 may be alternatively (or additionally) provided outside of the cavity 325, for example, proximate the opposite side of each block 310 and a joist 115 (or 150, or 212), i.e., the side of the block 310 that is opposite the side facing the cavity 325.

As seen in FIGS. 2-4, the nailing strips 305 may be positioned such that their longitudinal axis is substantially perpendicular to the longitudinal axis of the truss (115, 150, or 212).

FIG. 5 shows an example of a process for providing a complete exterior wall insulation assembly or envelope in a multilevel modular building, according to principles of the disclosure.

Referring to FIGS. 2-5, the process includes positioning a nailing strip 305 proximate a side of each joist 115 (150, or 212) at a predetermined distance (e.g., 5½″) from an interior edge of the exterior sheathing 320, wherein the longitudinal axis of the nailing strip 305 may be positioned at substantially ninety-degrees with respect to the longitudinal axis of the joist 115 (150, or 212) (Step 410). Each nailing strip 305 may then be attached to the joist 115 (150, or 212) (Step 420). A block 310 may then be positioned proximate a pair of nailing strips 305 between a pair of joists 115 (150, or 212) and attached to the nailing strips 305 (Step 430). A hole (or opening) 335 (e.g., a 1½″ round hole) may be drilled in (or cut out) a portion of the exterior sheathing 320 (Step 440). In this regard, the hole may be drilled, e.g., in a center area of the cavity 325, e.g., between a pair of joists 115 (150, or 212). The modules of the levels 101, 201 may then be transported to, e.g., a building site (Step 450), where the modules may be assembled into the modular building (Step 460). A foam material (such as, e.g., an insulating foam, a “pour fill” open cell spray foam, or the like) may be injected into each cavity 325 through the holes 335 (Step 470). The foam material may create a continuous insulation (e.g., R-19) and air barrier around the entire perimeter of the modular building. For example, a spray foam insulation may be first injected into the cavities 325 through the holes 335 in the exterior sheathing 320 between the lower joists 150, followed by injecting the spray foam into the cavities 335 through the exterior sheathing 320 between the upper joists 212.

FIG. 6 shows a detailed view of another example of a section that may be included in the multilevel modular building 100 shown in FIG. 1. In particular, FIG. 6 shows a system of creating a space for pre-installed (e.g., factory) ductwork (and/or plumbing, wiring, etc.) between levels 101 and 201 in the multilevel modular building 100, including, e.g., a section between the level 101 and the level 201 (shown in FIG. 1). The space created between the levels 101 and 201 may substantially reduce the transfer of noise between the levels 101 and 201.

Referring to FIG. 6, the level 101 may comprise a wall 30 having a plurality of wall studs 1105 (e.g., 2″×6″ at 16″ O.C.), a plurality of cross-blocks 1110 (e.g., 2″×6″ blocking), sheathing 1115, spacer 1120 (e.g., ½″ plywood spacer, 4½′ wide minimum), and the double top plate 165. The double top plate 165 may be affixed to, e.g., the joists 150 (e.g., 2″×6″ floor joists at 24″ O.C.) by fasteners 1135 (e.g., #10×4″ screws at 6″ O.C. TOED). The level 101 may further comprise the first band joist 170 (e.g., including factory installed RT 16F rafter ties, or the like, on 16″ centers with, e.g., 16d nails at each end).

The level 201 may comprise a wall 220 having a plurality of wall suds 1205 (e.g., 2″×6″ at 16″ O.C.), a plurality of cross-blocs 1210 (e.g., 2″×6″ blocking), exterior sheathing 1215 and the bottom plate 222, which may be attached to the floor 215 by means of, e.g., fasteners (e.g., #8×4″ screws (6) per truss bay above aligned with center of the band joist 205). The level 201 may further comprise a plurality of joists 1250 (e.g., 2″×10″ floor joists at 16″ O.C.) and the band joist 205 (e.g., including rows of #8×4″ min. screws at 32″ O.C.), which may be attached to the sill plate 210 (e.g., 2″×6″ sill plate) by means of fasteners 1220 (e.g., #10×4″ screws at 5″ O.C. TOED) or fasteners 1225 (e.g., 16 d nails at 6″ O.C.). The sill plate 210 may be further attached (or affixed) to the band joist 170 by means of fasteners 1225 (or fasteners 1220). In this regard, the sill plate 210 may be placed on top of the band joist 170 and attached by means of the fasteners 1225 (or fasteners 1220).

The second level 201 may be further attached to the first level 101 by, e.g., installing a plate tie 1260 (e.g., USP MP4 plate tie, or the like, 2 feet from the corners and 3 feet thereafter, e.g., using (6) 8d×1.5″ nails into plate and header with the long side of the plate being set horizontally) and installing the fasteners 275 (e.g., field installing RS250 tie, or the like, on the outside of the sheathing 1215, with stud location to be aligned on top and bottom modules and straps to be in the center of each stud). A mid-band sheathing 1270 may be installed, for example, on site, with duplicate fastening above and below.

According to a non-limiting example of the disclosure, the joists 1250 may include 2″×10″ joists positioned at sixteen inch O.C., the joists 150 may include 2″×6″ joists positioned at twenty-four inch O.C., the band joist 170 may include dual 2″×12″ beams, the band joist 205 may include dual 2″×10″ beams, and the sill plate 210 may include a 2″×6″ sill plate. In this example, the overall distance between the floor 215 and the ceiling 160 may be approximately one-foot-and-eleven-and-one-quarter inches (i.e., H=1′ 11¼″); the height of the upper joist 1250 may be approximately nine-and-one-quarter inches (i.e., UJ=9¼″); the height of the lower joist 150 may be approximately five-and-one-half inches (i.e., LJ=5½″); and, the height of the space between the upper joists 1250 and lower joists 150 may be approximately seven-and-one-quarter inches (i.e., S=7¼″), which is adequate for most HVAC ductwork, plumbing pipes, electrical wiring, and the like.

FIG. 7 shows an example of a process for constructing the modular building 100 with a space for preinstalled (or factory installed) ductwork, plumbing, electricity, and the like, between levels of a multi-level building. Initially, referring to FIGS. 1, 6 and 7, the walls 130, joists 115, 150, and band joist 170 may be assembled for one or more modules of the lower level 101 (Steps 510 to 530). The ductwork (and/or plumbing, wiring, and the like) may be installed into the assembled lower level 101 modules (Step 540). It is noted that the sequence of Steps 510 to 540 may be altered without deviating from the scope or spirit of the disclosure.

Simultaneously (or at a different time), the walls 220, joists 1250 (or 212), and band joist 205 may be assembled for one or more modules of the upper level 201 (Steps 515 to 545). The sill plate 210 may be attached to either the upper level band joist 205 (Step 545) or the lower level band joist (not shown). It is noted that the sequence of Steps 515 to 545 may be altered without deviating from the scope or spirit of the disclosure.

After the first level 101 and second level 201 modules are assembled, the modules may be transported to, e.g., the building site (Step 550). At the building site, the modules may be combined and assembled into the multilevel modular building 100 (Step 555). For example, the second level 201 modules may be placed atop of the first level 101 modules and affixed to each other using fasteners, such as, e.g., screws, nails, ties, straps, or the like.

FIG. 8 shows another example of a section of the multilevel modular building 100 (shown in FIG. 1). In particular, FIG. 8 shows an example of a cross-sectional side view of a portion of the multilevel modular building 100. The first level 101 may comprise a plurality of walls 605, a ceiling 610 and a floor (not shown). The ceiling 610 may include, e.g., gypsum board(s), a plurality of ceiling joists 620 (e.g., 2″×6″ ceiling joists), a band joist 625 (e.g., a multi-beam assembly, such as, e.g., 2″×12″ beams), and a sill plate 630. The level 101 may further comprise a double top plate 615 (e.g., double 2″×6″ top plate). A plurality of substantially continuous beads 1155 (e.g., a construction adhesive, a silicone material, or the like) may be applied to the entire perimeter of the multilevel building 101, e.g., between the double top plate 615 and the ceiling 610 of the level 101, thereby substantially eliminating air infiltration between the ceiling 610 and double top plate 615. Although any number of continuous beads 1155 may be used, three continuous beads 1155 are used in the preferred embodiment.

The first level 101 may further comprise a plurality of nailing strips 805 (e.g., 2″×4″ studs, shown in FIG. 10), each of which may be positioned at a predetermined distance (e.g., 6″ from the inner most edge of the nailing strip) from an innermost edge of the band joist 625. The nailing strips 805 may be positioned such that the longitudinal axis of each of the nailing strips 805 is substantially perpendicular to the longitudinal axis of the joist 620 to which it is attached. A panel portion 650 may be affixed to the innermost edge of the nailing strips 805, thereby creating a cavity 635 between the innermost edge of the band joist 625 (and band joist 725) and the panel portion 650, as well pairs of joists 620 (and 720).

Similarly, the second level 201 may comprise a plurality of walls 705, a ceiling (not shown) and a floor 215. The floor 215 may comprise, e.g., plywood (or OSB sturdi floor 20″ O.C., or the like), a plurality of floor joists 720, a band joist 725 (e.g., a multi-beam assembly, such as, e.g., 2″×12″ beams), and the sill plate 630. In this regard, the sill plate 630 may be provided as part of the lower level 101 modular portions or the upper level 201 modular portions. The walls 705 may include, e.g., drywall 707, framing 708 (e.g., 2″×6″ stud framing), and a sill plate 715 (e.g., 2″×6″ stud). A plurality of substantially continuous beads 2155 (e.g., a construction adhesive, a silicone material, or the like) may be applied to the entire perimeter of the multilevel building, e.g., between the sill plate 715 and the floor 710 of the level 201, thereby eliminating air infiltration between the sill plate 715 and floor 710. Although any number of continuous beads 2155 may be used, three continuous beads are used in the preferred embodiment. FIG. 9 shows a detailed view of the continuous beads 2155 between the sill plate 715 and floor 215.

The second level 201 may further comprise a plurality of nailing strips 805 (e.g., 2″×4″ studs), each of which may be positioned at a predetermined distance (e.g., 6″ from the inner most edge of the nailing strip 805) from an innermost edge of the band joist 725. The nailing strips 805 may be positioned such that the longitudinal axis of each of the nailing strips 805 is substantially perpendicular to the longitudinal axis of the joist 720 to which it is attached. The panel portion 650 may be affixed to the innermost edge of the nailing strips.

At least one of the band joist 625 and 725 may be provided with a plurality of holes (or openings) 735 (e.g., 1½″ holes) leading into each of the cavities 635, which are formed between pairs of joists 620 (and/or 720). The holes 735 may be provided through the width the band joist 625 (and/or 725), thereby providing a passage for inserting a fluid, a solid and/or a gas material from outside the modular building into each cavity 635. Each hole 735 may be provided in a portion of the band joist 625 (and/or 725), including the center (or any other location) between a pair of joists 620 (and/or 720).

As seen in FIG. 8, a panel 750 (e.g., an OSB panel) may be affixed (or attached) to an exterior side of the band joists 625, 725.

FIG. 9 shows a zoomed-inn view of the section identified in FIG. 8 of the multilevel modular building 100.

FIG. 10 shows a top or plan view of the exemplary section in FIG. 8 of the multilevel modular building 100. As seen in FIG. 10, the panel 650 may be configured to form the cavity 635 having a depth d (e.g., about 6″).

FIG. 11 shows a side view of a floor portion 900 of, e.g., the level 101 of FIG. 1. The floor portion 900 may be placed atop of a stem wall 905, divided by, e.g., a sill plate 910 (e.g., 2″×6″) and a termite shield 915. The floor portion 900 may comprise a plurality of open-web floor trusses 920 (or solid beams, such as, e.g., 2″×10″, 2″×12″, or the like), band joist(s) 925 (e.g., multiple 2″×10″ beams), lower sill plate(s) 930 (e.g., 2″×6″), upper sill plate(s) 935 (e.g., 2″×6″), and floor panels 940 (e.g., 4′×8′ plywood). The wall 605 may be affixed to the floor panels 940 by, e.g., providing a plurality of substantially continuous beads 4355 (e.g., a construction adhesive, a silicone material, or the like) to the entire perimeter of the multilevel building 100, e.g., between the sill plate 935 and the floor panels 940, thereby eliminating air infiltration between the sill plate 935 and floor panel 940.

FIG. 12 shows a detailed view of the connecting portion between the sill plate 935 and floor panels 940, including continuous beads 4355. Although any number of continuous beads 4355 may be used, three continuous beads are used in the preferred embodiment. Of course, fasteners (e.g., nails, screws, bolts, nuts, or the like) may be used to fasten the sill plate 935 to the floor panels 940 and/or sill plate 930.

FIG. 13 shows an example of a process for providing a complete exterior wall insulation assembly or envelope in a multilevel modular building, according to principles of the disclosure.

Referring to FIGS. 8-10 and 13, the process includes positioning a nailing strip 805 proximate a side of each joist 620 (and/or 720) at a predetermined distance (e.g., 6″) from an edge of the joist 620 (and/or 720), wherein the longitudinal axis of the nailing strip 805 may be positioned at substantially ninety-degrees with respect to the longitudinal axis of the joist 620 (and/or 720) (Step 1010). Each nailing strip 805 may then be attached to the joist 620 (720) (Step 1020). A panel 650 may then be positioned proximate a pair of nailing strips 805 between a pair of joists 620 (720) and attached to the nailing strips 805 (Step 1030). A hole 735 (e.g., 1½″) may be drilled in, and through a portion of the band joist 625 (and/or 725) to the cavity 635 (Step 1040). In this regard, the hole may be drilled, e.g., in a center area of the cavity 635, e.g., between a pair of joists 620 and/or 720). The modules of the levels 101, 201 may then be transported to, e.g., a building site (Step 1050), where a foam material (such as, e.g., an insulating foam, a “pour fill” open cell spray foam, or the like) may be injected into each cavity 635 through the holes 735 (Step 1060). The foam material may create a continuous insulation (e.g., R-19) and air barrier around the entire perimeter of the modular building. For example, a spray foam insulation may be first injected into the cavities 635 through the holes 735 in the lower band joist 625, followed by injecting the spray foam into the cavities 635 through the upper band joist 725.

Although the disclosure provides a number of examples of materials and dimensions that may be implemented within the scope and breadth of the disclosure, it is noted that other materials and dimensions may be implemented equally, without departing from the scope or spirit of the disclosure. For instance, metal, plastic, fiberglass, or the like, materials may be used instead of, or in addition to the wood or manufactured wood components described herein. For example, the joist 115, 150, may include solid wood beams, manufactured wood trusses, metal beams (e.g., steel beams), load bearing fiberglass beams, or the like.

While the disclosure has been described in terms of exemplary embodiments, those skilled in the art will recognize that the disclosure can be practiced with modifications in the spirit and scope of the appended claims. These examples given above are merely illustrative and are not meant to be an exhaustive list of all possible designs, embodiments, applications or modifications of the disclosure. 

1. A modular structure for creating a substantially airtight, well insulated building envelope in a multilevel building that reduces air or moisture infiltration, the modular structure comprising: a plurality of joists separated by a predetermined distance and aligned along a first direction; a plurality of nailing strips located proximate each of the plurality of joists and aligned along a second direction, which is substantially perpendicular to the first direction; a band joist aligned along a third direction, which is substantially perpendicular to the first direction or the second direction; an exterior sheathing; and a block, wherein at least two of the band joist, the exterior sheathing and the block are configured to form a cavity for receiving an insulating material.
 2. The modular structure according to claim 1, wherein the band joint comprises a multi-beam assembly.
 3. The modular structure according to claim 1, wherein the plurality of nailing strips are positioned so that a longitudinal axis of at least one of the nailing strips is substantially perpendicular to a longitudinal axis of at least one of the plurality of joists.
 4. The modular structure according to claim 1, wherein a side of at least one of the plurality of nailing strips is located a predetermined distance away from the exterior sheathing.
 5. The modular structure according to claim 4, wherein an opposite side of the at least one of the plurality of nailing strips is located proximate to the block.
 6. The modular structure according to claim 1, wherein the sheathing comprises an opening to allow access to the cavity, and wherein the insulating material is injected in the cavity through the opening.
 7. The modular structure according to claim 1, wherein the band joist comprises an opening to allow access to the cavity, and wherein the insulating material is injected in the cavity through the opening.
 8. The modular structure according to claim 1, further comprising: a floor; a sill plate; and a substantially continuous bead between the floor and the sill plate.
 9. A method for creating a substantially airtight and well insulated building envelope, the method comprising: aligning a plurality of joists along a first direction; aligning a plurality of studs along a second direction, which is substantially perpendicular to the first direction; aligning a band joist along a third direction, which is substantially perpendicular to the first direction or the second direction; aligning an exterior sheathing in a plane that is substantially perpendicular to the first direction; and providing a block between two of the plurality of joists at a predetermined distance from the exterior sheathing, wherein at least two of the band joist, the exterior sheathing and the block are configured to form a cavity for receiving an insulating material.
 10. The method according to claim 9, further comprising: aligning a plurality of nailing strips along the second direction, wherein the nailing strips are configured to support the block.
 11. The method according to claim 10, wherein the plurality of nailing strips are positioned at a predetermined distance from the exterior sheathing.
 12. The method according to claim 10, further comprising: assembling the plurality of joists, the plurality of studs, the band joist, the block and the exterior sheathing.
 13. The method according to claim 10, further comprising: providing an opening in at least one of the band joist and the exterior sheathing.
 14. The method according to claim 12, further comprising: providing an opening in at least one of the band joist and the exterior sheathing; and injecting the insulating material into the cavity to substantially fill the cavity.
 15. The method according to claim 12, further comprising: providing a floor; providing a sill plate; and applying a substantially continuous bead between the floor and the sill plate.
 16. A method for creating a substantially airtight and well insulated building envelope, the method comprising: aligning a plurality of joists along a first direction; aligning a plurality of studs along a second direction, which is substantially perpendicular to the first direction; aligning a band joist along a third direction, which is substantially perpendicular to the first direction or the second direction; aligning an exterior sheathing in a plane that is substantially perpendicular to the first direction; providing a block between two of the plurality of joists at a predetermined distance from the exterior sheathing; and assembling the plurality of joists, the plurality of studs, the band joist, the block and the exterior sheathing, wherein at least two of the band joist, the exterior sheathing and the block are configured to form a cavity for receiving an insulating material.
 17. The method according to claim 16, further comprising: providing a plurality of nailing strips along the second direction, wherein the nailing strips are configured to support the block.
 18. The method according to claim 16, further comprising: providing an opening in at least one of the band joist and the exterior sheathing.
 19. The method according to claim 16, further comprising: providing an opening in at least one of the band joist and the exterior sheathing; and injecting the insulating material into the cavity to substantially fill the cavity.
 20. The method according to claim 15, further comprising: providing a floor; providing a sill plate; and applying a substantially continuous bead between the floor and the sill plate. 